Dimkes launches M-Chipuka for mobile loan access
20 March 2020
Dimkes Sacco has launched an e-loan platform dubbed M-Chipuka to allow its members to access mobile loans.
M-chipuka will be accessible to Android App and iOS users, it can also be accessed via USSD code *850# as it seeks to improve the Sacco’s operation efficiency while reducing cost to members in a bid to offer quality services.
Dimke’s CEO Benson Macharia during the launch noted that digital loan apps had disrupted the market thus challenging traditional players such as banks and Saccos to rethink their strategy.
“Our entrance into the digital lending space is to protect our interest and prevent members from relying on other sources for short term loans,” he said.